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Er-Ping Li

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Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

by Er-Ping Li First published in 2012 — 5 editions

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Plasmonic Nanoelectronics and Sensing

by Er-Ping Li First published in 2014 — 3 editions

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Electrical modeling and design for 3D integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC

by Er-Ping Li First published in 2011 — 1 edition

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OLID: OL6984240A

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Created October 20, 2011
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October 20, 2011

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