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Subjects
Congresses, Materials, Integrated circuits, Semiconductors, Electronics, Metallizing, Materials, research, Very large scale integration, Design and construction, Dielectric films, Dielectrics, Electric insulators and insulation, Electric properties, Electronic Engineering (Specific Aspects), Electronic packaging, Electronics, data processing, Electronics, materials, Elektronik, Halbleitertechnologie, Halbleiterwerkstoff, Integrated circuits, very large scale integration, Junctions, Materials, mechanical properties, Matériaux, MicroelectronicsID Numbers
- OLID: OL836799A
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| August 22, 2008 | Edited by RenameBot | fix author name |
| April 1, 2008 | Created by an anonymous user | initial import |